In order to improve the efficiency of the power system, the design industry is often required to increase the density of the overall power grid under the premise of maintaining the system function. In order to improve the efficiency of the power system, the design industry is often required to maintain Under the premise of system function, increasing the density of the entire power supply rack, which means higher heat dissipation performance requirements and lower power loss challenges for the power connector. To meet these trends, manufacturers must also ensure that their power connectors have a smaller form factor and a more compact design when offering products with high linear current densities. Huang Wei, marketing manager of Molex Global Business Products Group Business Group, said that the Micro-Fit 3.0TM product family is a compact small-size solution for mobile phones, tablets, laptops and other applications. Power Connector Design Quartet: Track 1: High Compact As the leader in the power connector market, Molex has a range of power connectors with high compact features. Huang Wei, from the marketing manager of Molex Global Commercial Products Group Business Group, pointed out in an interview that with Molex's Micro-Fit 3.0TM product family as an example, the connector has a pitch of only 3.00 mm and can carry up to 5.0 amps of rated current. Made from high-temperature LCP materials, proven technology ensures long-term performance and reliability for virtually any industry, including data communications equipment and heavy industry.
Micro-Fit 3.0TM Product Family Track 2: Flexibility In addition to the high compactness, power connectors must be extremely flexible in their design. At this point, Molex's approach is to combine compactness with excellent current density, such as Super SabreTM connectors, for ultra-narrow designs for high voltage and high current applications, on each blade. Offering up to 34 amps of current and up to +125Â°C operating temperature, proven technology ensures long-term performance and reliability for virtually any industry, including data communications equipment and heavy industry. Track 3: Heat Dissipation For the most important heat dissipation performance of the power system, Huang Wei said that the design of the connector has a direct impact on the internal airflow of the power supply, but the user cannot rely solely on the connector design to solve the heat dissipation problem. In order to optimize the system design, other factors must also be considered - such as the amount of copper on the PCB, copper can help absorb the heat of the connector interface. Track 4: High Efficiency At the same time, to meet the demands of higher power efficiency, Molex offers a solution with high compactness and high current characteristics â€“ the EXTreme BBCTM power bus connector. EXTreme BBCTM can directly pair two mutually perpendicular power busbars commonly found in power supply units or switching power supplies with current ratings up to 320 amps, providing up to 20% more current than competing products. Higher currents increase power or safety factor, while high-performance contact designs enable true hot-swap capability. Parallel contacts float freely within the BBC housing for easy blind insertion with busbar inserts. The low dropout design ensures that the heat generated is minimized. Applications include rack-mounted power supplies, telecommunications equipment, network hubs, switches and routers, and servers. Market Opportunities and Challenges for Power Connectors At the strategic level, Huang Wei emphasized that Molex will focus on five key areas of interconnection products in 2015: mobile, industrial, medical, data communications, and automotive. These five areas represent a fast-growing market, both in Asia and around the world. For example, the mobile field has experienced rapid growth in the past few years and hopes to maintain this momentum. In the future, innovation and quality also have a strategic position. Interconnect products are highly competitive and are designed to meet the highest standards for unparalleled signal integrity and power integrity. Http://?itemid=389 http://news.chinawj.com.cn Editor: (Hardware Business Network Information Center) http://news.chinawj.com.cn
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